PFA GBK Sheet

Raw Materials: Daikin PFA resin (Japan), inotsigirwa neGBK girazi fiber jira. PFA ine zvirinani stress crack resistance (F50 Yakakura kudarika kana kuenzana nemaawa 1000) pane PTFE (F50 Iri pasi kana kuenzana nemaawa 500), inonyatsokodzera kwenguva refu-zvinoitika zvekumanikidzika.
Maitiro: RANA inosimudzira kubatana pakati pePFA neGBK faibha kuburikidza ne "hot-press melting" maitiro (bonding force Yakakura kupfuura kana kuenzana ne6N/cm), kudzivirira kutsemuka kunokonzerwa nekufunganya.

Core: Kusanganiswa kwe "stress crack resistance + high purity" yePFA uye "high simba + fatigue resistance" yeGBK fiber inoita kuti lining Sheet irambe yakasimba (hapana kutsemuka, pasina peeling) pasi penguva refu-kudzvinyirirwa kwenguva refu (semuenzaniso, kuenderera mberi kwekushanda pa2MPa), kuchinjira kune-kuguma kwemakemikari zvinodiwa.

Zvakanakira: Yakasimbiswa nechikwata chenyanzvi dzekuTaiwan, hairatidzi kutsemuka mushure memaawa 5000 ekushanda nguva dzose pa2MPa pressure, ine tembiricha yekuramba ye -200℃kusvika 260℃. Senhengo yeChina Semiconductor Industry Association, chigadzirwa chinopindirana nepamusoro pehutsanana hunodiwa hwe semiconductor yakakwirira-kuchena midziyo (semuenzaniso, photoresist kuchengetedza matangi).
Mamiriro Ekushandisa: Inoshandiswa mukuita kwemakemikari akakwira-eg, polyethylene synthesis) uye semiconductor yakakwirira-michina yekuchena (semuenzaniso, electronic-grade nitric acid matangi ekuchengetera). Yakapa zvigadziriso zveSMIC neQiaoli Chemical (Taiwan, China), kuve nechokwadi chekuchengetedza-kwenguva refu kushanda kwemichina uye kuchena kwepakati (metal ion content Zvishoma pane kana kuenzana ne0.05ppb).

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